| 1. | Several glass frit pastes are commercially available, e . g.
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| 2. | The printed glass frit structures are heated to form compact glass.
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| 3. | The auxiliary electrode may be isolated from the working electrode using a glass frit.
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| 4. | Two options are used, a glass frit bond ring or a metallic bond ring.
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| 5. | Early covered resonators with glass frit seals were unstable because contaminants outgassed from the sealing material.
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| 6. | The most common wafer-level packaging techniques are based on anodic and glass frit wafer bonding.
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| 7. | Further, the bonding yield of glass frit bonded wafers is very high, normally > 90 %.
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| 8. | The risk of glass frit flowing into the structures can be prevented by optimization of the screen printing process.
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| 9. | For more demanding applications, the filter paper in the latter two may be replaced with a sintered glass frit.
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| 10. | Glass frit as a dielectric material does not need additional passivation for preventing leakage currents at process temperatures up to 125 �C.
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